Marscomponents News

Six Leading Optical Device Manufacturers Bet on VCSEL Near-Package Optical Solutions

 A recent report by TrendForce, "Infrared Sensing and Optical Communication Market Trends 2027," points out that with the continuous expansion of data center networks and the rapid increase in data transmission demands, near-packed optical (NPO) technology based on vertical-cavity ...


Advanced Packaging: Substrates Become a Bottleneck for High-End Chips
Not only leading-edge wafers and memory are currently limiting the expansion of high-performance computing hardware. Broadcom CEO Hock Tan also cites substrates as a critical bottleneck. Starting in fiscal year 2027, additional substrate capacity will therefore be available in Singapore.
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Nvidia AI Servers See Price Hike Over 15%: The Butterfly Effect of a Single Memory Chip

 On August 22nd, Bloomberg broke the news, quickly going viral in the tech world: Nvidia has notified some of its largest customers that server prices equipped with its AI chips will generally increase, with most increases exceeding 15%.

 
After the news reached Ch...

Micron's High-End Memory Product Portfolio is Comprehensive

 Micron Technology has become a core supplier in the AI ??computing ecosystem. Leveraging its technological leadership in high-end DRAM, high-bandwidth memory (HBM), and NAND flash memory, the company meets the explosive growth in demand from hyperscale data centers and AI acceleration chip ...


Kehua Digital Energy's PCS Enters Vietnam's First Large-Scale Grid-Side Energy Storage Project

 Kehua Digital Energy's BCS1250K-C-HUD series PCS (Power Conversion System) has been deployed in a 50MW/100MWh energy storage project in Hanoi, Vietnam. This project marks the first large-scale energy storage application in the capital's power grid. The project consists of five 10MW/20MWh en...


SanDisk Showcases SANDISK Optimus? SSDs at BILIBILI WORLD 2026

 SanDisk, a global leader in advanced flash memory and storage technologies, announced its participation in BILIBILI WORLD 2026 (BW2026), the annual ACGN (Anime, Comics, Games, and Novels) cultural event, from July 10th to 12th. Under the visual theme "A New Journey Begins, Join Us,&quo...


MediaTek Issues Price Increase Notice: Dimensity 9600 Pro Unit Procurement Price Approaching $216

 Recently, MediaTek issued a rare public notice announcing price adjustments for its products. This is one of the few times in recent years that MediaTek has initiated a price adjustment mechanism with customers via written notice. With global semiconductor supply chain costs continuing to r...


HPE Adds NVIDIA Vera CPU Computing Nodes to Private Cloud AI Solution

 The AI ??industry's focus is shifting from large-scale model training to routine inference, making CPUs with massive addressable memory capacity a market necessity. At its annual Discover conference, Hewlett Packard Enterprise (HPE) officially announced that it will integrate the ProLiant D...


By 2030, SoCs will account for over half of the global radar chip market

 At the "2026 Gateland Day" held in Shanghai recently, Chen Jiashu, founder of Gateland, stated that SoC-based radar edge processing architectures have significant advantages over central processing architectures in terms of system cost, engineering complexity, functional safety, a...


Melexis Introduces World's First 2-Wire Output 2-Position Hall Switch

 June 5, 2026, Tessendloë-Ham, Belgium – Melexis, a global microelectronics engineering company, today announced the MLX92344, a highly flexible PCB-free solution enabling contactless sensing at up to four positions without the need for bulky microswitches. The device introduces f...


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