Marscomponents News

Dialog Expands Leading Position in Configurable Mixed-Signal ICs with Over 3.5 Billion Devices Shipped

 Dialog Semiconductor, a supplier of highly integrated power management, AC/DC power conversion, charging, solid-state lighting (SSL) and Bluetooth low-power technology, announced that its total shipments of configurable mixed-signal IC (CMIC) products have exceeded 3.5 billion set. This mil...


Apple trials iPhone 6s Plus Wistron OEM in India

 Indian media quoted two industry executives today as saying that Apple Inc. ("Apple") has begun trial production of the iPhone 6s Plus in India and is expected to begin mass production several weeks later.

 
The two people familiar with the matter said t...

MediaTek Expands ASIC Product Line Industry's First 7nm Intellectual Property

 IC design giant MediaTek announced on the 10th that it has introduced the industry's first 56-Gigabit PAM4 SerDes intellectual property (IP) with a 7-nm FinFET silicon certification (Silicon-Proven) to further expand its ASIC product line. MediaTek said that the 56G SerDes solution is based...


ADI Isolated Driver Board for MicrosemiSiC Power Modules to Accelerate Time-to-Market

 Analog Devices, Inc. (ADI) and Microsemi Corporation recently unveiled the market's first high-power evaluation board for half-bridge SiC power modules that delivers up to 1200V and 50A at 200kHz switching frequency. Isolators are designed to increase design reliability while reducing the n...


Toshiba introduced V30 speed grade EXCERIA MicroSDXC card

 Toshiba introduced a new EXCERIA microSDXC card, named M303, its speed rating V30, providing a minimum data transfer rate of 30MB / s, UHS-I U3 speed grade to meet the user snap moments and 4K ultra-high definition video recording and other needs.

 
Toshiba M303 s...

Melexis Introduces New Automotive Grade Fan Driver IC for Small Form Factor Applications

 Melexis today announced the release of its new automotive-grade fan driver ICs, US168KLD and US169KLD, for automotive and other applications that require high reliability and ultra-small form factor solutions.

 
The US168KLD and US169KLD are automotive-grade singl...

SUMCO increase investment in the first half of 2019 12-inch monthly capacity increased by 110,000

 2018 is coming, silicon wafer is still in short supply, the price will continue to rise. Japanese silicon wafer giant SUMCO announced that due to the strong demand for semiconductors to boost silicon wafer as a substrate material demand rammer, tight supply and demand, it is decided to incr...


The fourth generation of VG core DRAM chips listed next year, Naura record grab 14nm equipment market

 Rising for nearly two consecutive days of the core of the country in the light of several agencies surveyed said that the first three quarters due to increased investment in research and development and intensified market competition, the overall gross profit margin decreased, resulting in ...


Eaton Fuses meet higher power requirements for computers and telecommunications systems

Eaton, a leader in power management technology, today announced the introduction of the Bussmann® Series 1025HC High Current Fast-Acting Surface Mount (SMD) fuses for next-generation telecommunications and computer systems. Developers can use this new compact family of products to achieve hig...


Dialog Energous Accelerates Universal Wireless Charging

Dialog announced strategic investment Energous, Energous developed a revolutionary wireless charging technology WattUp, in the air long-distance power supply. Dialog has agreed to invest $ 10 million to invest in Energous and become an exclusive supplier of WattUp integrated circuit (ICs) compone...


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