Marscomponents News

IDC: AI will be an important indicator and pusher for future work patterns.

 IDC (International Data Information) took the lead in predicting that global enterprises will enter the stage of digital transformation (DX) five years ago, and recently proposed the future work, FoW (Future of Work) concept. Yan Lanxin, deputy director of IDC terminal systems research, sai...


QORVO uses the new high-performance small base station infrastructure products to lay the road to 5G

 Qorvo, Inc., a leading provider of core technologies and RF solutions for mobile applications, infrastructure and defense applications, today announced new low-efficiency, small-cell front-end solutions for the wireless infrastructure market below 6 GHz. The product significantly increases ...


MediaTek released two series of processor drivers to accelerate the development of the AIoT ecosystem

 On April 18, 2019, the world's leading IC design company MediaTek released the AioT platform, which includes i300 and i500 series processor chips with high integration and high-end APU performance, providing the industry with smart home, smart city and smart factory. Large-scale solutions h...


Samsung announced that it has developed the first 10nm third-generation ultra-high performance and high-efficiency DRAM

 According to Samsung Electronics official website, as the global leader in advanced memory technology, Samsung Electronics announced today (21) the third generation of 10 nanometer (1z-nm) 8GB ultra-high performance and high efficiency DRAM (Dynamic Random Access Memory, dynamic Random acce...


KVH high-precision fiber optic gyroscope products adopt photonic chip technology

 KVH Industries recently announced that it has integrated photonic chip technology into high-precision fiber optic gyro products and delivered new photon gyroscope inertial measurement devices to selected users at the end of December last year (Photonic Gyro) Prototype of IMU). Developed by ...


Mitsubishi Electric and the University of Tokyo have reached a cooperation to propose a new mechanism to improve the reliability of SiC power semiconductors

 At the IEEE 64th International Conference on Electronic Devices (IEDM 2018) (December 1st to 5th) in San Francisco, California, Mitsubishi Electric Corporation and the University of Tokyo proposed a new mechanism to improve the reliability of SiC power semiconductors.

 
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Taiwan team successfully developed monoatomic diodes with a thickness of only 0.7 nm
The breakthrough in the process of integrated circuit, the team composed of Professor Wu Zhonglin from the Department of Physics of the University of Science and Dr. Chen Jiahao from the National Synchrotron Radiation Research Center, successfully developed the selenization of a single atomic l...

Melexis TPMS sensor escorts commercial vehicle safety

 Melexis, a global microelectronics engineering company, announces the third generation of tire pressure monitoring system (TPMS) sensors with extended pressure range - MLX91804-007/008, which significantly improves road safety by improving tire pressure monitoring in commercial vehicles .


NXP announces executive team reorganization Kurt Sievers promotes to president

 Recently, NXP Semiconductors announced the reorganization of its executive team to continue to drive the company's new business focus and development strategy.

 
Kurt Sievers, NXP's current executive vice president and general manager of the automotive division, w...

Qorvo multi-sensor and universal switch expansion is the first to receive ZigBee Green Power v1.1 certification

 Qorvo, Inc., a leading provider of RF solutions for mobile applications, infrastructure and aerospace and defense applications, today announced that its multi-sensor and general-purpose switching features have been ZigBee Green Power v1.1 certifie...


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